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Semiconductor Equipm. 18074-6.50 Dicing Tape, Standard, Blue, 6.5" x 660 ft. BLU For Sale

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Semiconductor Equipm. 18074-6.50 Dicing Tape, Standard, Blue, 6.5" x 660 ft. BLU:
$400.00
Semiconductor Equipment Corp. 18074-6.50 Dicing Tape, Standard, Blue, Medium Tack, 6.5-inch x 660 ft., 1 RollThickness 75 um / .003”
Sawing silicon wafers with smaller die sizes. Adhesion level is slightly greater than Low Tack-Blue to more firmly hold die to tape but low enough to easily remove die in the next operation.Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.

Semiconductor Equipm. 24339-9.00 Dicing Tape, Clear, UV Curable, 9-inch, 3.3 mil
$180.00

Semiconductor Equipm. 18074-6.50 Dicing Tape, Standard, Blue, 6.5" x 660 ft. BLU
$400.00

Semiconductor Equipm. 19161-10.5 Dicing Tape, Standard, Clear, 10.5" x 330 ft.
$180.00